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Next-Gen AI Liquid Cooling

⚡ AI & HPC High-Density Infrastructure (50kW/Rack)

Standard enterprise data centers cannot handle the 30kW to 50kW power density of modern AI GPU clusters. South IDC's Tseung Kwan O facility is purpose-built for AI and High-Performance Computing (HPC), combining hybrid liquid cooling with high-capacity power feeds.

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Architecture & Form Factors

Direct-to-Chip (DLC) Water Loops

Coolant Distribution Units (CDUs) circulating conditioned water directly to GPU/CPU cold plates, capturing 80% of heat load.

Rear Door Heat Exchangers (RDHx)

Active chilled-water rear door coils absorbing remaining secondary thermal load, delivering room-neutral air exhaust.

InfiniBand & RoCE Fabric Layout

Engineered cable trays and short-run optical harnesses optimized for non-blocking 400G/800G GPU cluster fabrics.

Three-Phase High Amperage Power

Dual 3-phase 415V 63A or 100A PDU drops per rack supporting uninterrupted GPU training runs.

Technical Specifications

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Extreme Power Density

Certified for continuous 40kW to 50kW IT load per rack without thermal throttling.

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Ultra-Low Facility PUE

Advanced heat exchange architecture operating at an annual PUE of 1.15 to 1.18.

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Leak Detection & Safe Condensation

Under-floor and intra-rack optical liquid leak sensing with automated solenoid shutoff valves.

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Structural Heavy-Floor Loading

Reinforced floor capacity supporting up to 2,500 kg per rack for dense multi-GPU chassis.

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